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期刊


ISSN1057-7157
刊名Journal of Microelectromechanical Systems
参考译名微机电系统杂志
收藏年代1998～2013



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1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013

2011, vol.20, no.1 2011, vol.20, no.2 2011, vol.20, no.3 2011, vol.20, no.4 2011, vol.20, no.5 2011, vol.20, no.6

题名作者出版年年卷期
Strengthening for sc-Si Solar Cells by Surface Modification With NanowiresChi-Nan Chen; Chuan-Torng Huang; Chen-Liang Chao; Max Ti-Kuang Hou; Wen-Ching Hsu; J. Andrew Yeh20112011, vol.20, no.3
Acceleration of Microwelding on Ohmic RF-MEMS SwitchesAugusto Tazzoli; Gaudenzio Meneghesso20112011, vol.20, no.3
A Single-Polarity Piezoresistive Three-Dimensional Stress-Sensing RosetteH. H. Gharib; W. A. Moussa20112011, vol.20, no.3
Frequency Tuning of VO_2-Coated Buckled MicrobridgesEmmanuelle Merced; Rafmag Cabrera; Horacio Coy; Felix E. Fernandez; Nelson Sepulveda20112011, vol.20, no.3
Solder Pump Technology for Through-Silicon via FabricationJiebin Gu; W. T. Pike; W. J. Karl20112011, vol.20, no.3
One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous IntegrationFabian Zimmer; Martin Lapisa; Thor Bakke; Martin Bring; Goran Stemme; Frank Niklaus20112011, vol.20, no.3
High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip-Tilt-Piston CapabilityKemiao Jia; Sean R. Samuelson; Huikai Xie20112011, vol.20, no.3
Fiber Endoscopes Utilizing Liquid Tunable-Focus Microlenses Actuated Through Infrared LightXuefeng Zeng; Carter T. Smith; Jon C. Gould; Charles P. Heise; Hongrui Jiang20112011, vol.20, no.3
A Three-Dimensional 64-Site Folded Electrode Array Using Planar FabricationSister Mary Elizabeth Merriam; Onnop Srivannavit; Mayurachat Ning Gulari; Kensall D. Wise20112011, vol.20, no.3
A Thermally Actuated Microelectromechanical (MEMS) Device for Measuring ViscosityIvan Puchades; Lynn F. Fuller20112011, vol.20, no.3
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