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期刊


ISSN1057-7157
刊名Journal of Microelectromechanical Systems
参考译名微机电系统杂志
收藏年代1998～2013



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2004 2005 2006 2007 2008 2009
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2009, vol.18, no.1 2009, vol.18, no.2 2009, vol.18, no.3 2009, vol.18, no.4 2009, vol.18, no.5 2009, vol.18, no.6

题名作者出版年年卷期
Wear of Polysilicon Surface Micromachines Operated in High VacuumShannon J. Timpe; Daan Hein Alsem; D. Adam Hook; Michael T. Dugger; Kyriakos Komvopoulos20092009, vol.18, no.2
Material Selection for Optimal Design of Thermally Actuated Pneumatic and Phase Change MicroactuatorsPrasanna Srinivasan; S. Mark Spearing20092009, vol.18, no.2
Frictional Aging and Sliding Bifurcation in Monolayer-Coated MicromachinesAlex D. Corwin; Maarten P. de Boer20092009, vol.18, no.2
Effect of Die-Bonding Process on MEMS Device Performance: System-Level Modeling and Experimental VerificationJing Song; Qing-An Huang; Ming Li; Jie-Ying Tang20092009, vol.18, no.2
Comparison of Au and Au-Ni Alloys as Contact Materials for MEMS SwitchesZhenyin Yang; Daniel J. Lichtenwalner; Arthur S. Morris, III; Jacqueline Krim; Angus I. Kingon20092009, vol.18, no.2
Free-Form Simulation of Sequential Etching and Surface Characterization for 3-D MEMS FabricationSanthosh K. George; Bahattin Koc20092009, vol.18, no.2
Double-Exposure Grayscale PhotolithographyLance Mosher; Christopher M. Waits; Brian Morgan; Reza Ghodssi20092009, vol.18, no.2
Variable-Size Solder Droplets by a Molten-Solder Ejection MethodYoshinori Yokoyama; Kazuyo Endo; Toshihiro Iwasaki; Hiroshi Fukumoto20092009, vol.18, no.2
Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate InterconnectKaran Kacker; Suresh K. Sitaraman20092009, vol.18, no.2
Precision In-Plane Hand Assembly of Bulk-Microfabricated Components for High-Voltage MEMS Arrays ApplicationsBlaise Gassend; Luis Fernando Velasquez-Garcia; Akintunde Ibitayo Akinwande20092009, vol.18, no.2
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