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期刊


ISSN1057-7157
刊名Journal of Microelectromechanical Systems
参考译名微机电系统杂志
收藏年代1998～2013



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2009, vol.18, no.1 2009, vol.18, no.2 2009, vol.18, no.3 2009, vol.18, no.4 2009, vol.18, no.5 2009, vol.18, no.6

题名作者出版年年卷期
Fabrication Methods and Performance of Low-Permeability Microfluidic Components for a Miniaturized Wearable Drug Delivery SystemMark J. Mescher; Erin E. Leary Swan; Jason Fiering; Maria E. Holmboe; William F. Sewell; Sharon G. Kujawa; Michael J. McKenna; Jeffrey T. Borenstein20092009, vol.18, no.3
A Novel Diamond Microprobe for Neuro-Chemical and -Electrical Recording in Neural ProsthesisHo-Yin Chan; Dean M. Aslam; James A. Wiler; Brendan Casey20092009, vol.18, no.3
A Micromachined Quartz Resonator Array for Biosensing ApplicationsPing Kao; Steffen Doerner; Thomas Schneider; David Allara; Peter Hauptmann; Srinivas Tadigadapa20092009, vol.18, no.3
Elastic Averaging for Assembly of Three-Dimensional Constructs From Elastomeric Micromolded LayersTheodore C. Marentis; Joseph P. Vacanti; James C. Hsiao; Jeffrey T. Borenstein20092009, vol.18, no.3
A Compliance-Based Microflow StabilizerBozhi Yang; Qiao Lin20092009, vol.18, no.3
Effect of Electrode Asymmetry on Performance of Electrohydrodynamic MicropumpsPouya Zangeneh Kazemi; Ponnambalam Ravi Selvaganapathy; Chan Y. Ching20092009, vol.18, no.3
New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin FilmsSebastien Gravier; Michael Coulombier; Asmahan Sari; Nicolas Andre; Alexandre Boe; Jean-Pierre Raskin; Thomas Pardoen20092009, vol.18, no.3
Anelastic Stress Relaxation in Gold Films and Its Impact on Restoring Forces in MEMS DevicesX. Yan; W. L. Brown; Y. Li; John Papapolymerou; C. Palego; J. C. M. Hwang; R. P. Vinci20092009, vol.18, no.3
Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion AnalysisChangsoo Jang; Arindam Goswami; Bongtae Han20092009, vol.18, no.3
Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on ChipRihui He; Chang-Jin Kim20092009, vol.18, no.3
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