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期刊


ISSN1057-7157
刊名Journal of Microelectromechanical Systems
参考译名微机电系统杂志
收藏年代1998~2013



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013

2009, vol.18, no.1 2009, vol.18, no.2 2009, vol.18, no.3 2009, vol.18, no.4 2009, vol.18, no.5 2009, vol.18, no.6

题名作者出版年年卷期
Wear of Polysilicon Surface Micromachines Operated in High VacuumShannon J. Timpe; Daan Hein Alsem; D. Adam Hook; Michael T. Dugger; Kyriakos Komvopoulos20092009, vol.18, no.2
Material Selection for Optimal Design of Thermally Actuated Pneumatic and Phase Change MicroactuatorsPrasanna Srinivasan; S. Mark Spearing20092009, vol.18, no.2
Frictional Aging and Sliding Bifurcation in Monolayer-Coated MicromachinesAlex D. Corwin; Maarten P. de Boer20092009, vol.18, no.2
Effect of Die-Bonding Process on MEMS Device Performance: System-Level Modeling and Experimental VerificationJing Song; Qing-An Huang; Ming Li; Jie-Ying Tang20092009, vol.18, no.2
Comparison of Au and Au-Ni Alloys as Contact Materials for MEMS SwitchesZhenyin Yang; Daniel J. Lichtenwalner; Arthur S. Morris, III; Jacqueline Krim; Angus I. Kingon20092009, vol.18, no.2
Free-Form Simulation of Sequential Etching and Surface Characterization for 3-D MEMS FabricationSanthosh K. George; Bahattin Koc20092009, vol.18, no.2
Double-Exposure Grayscale PhotolithographyLance Mosher; Christopher M. Waits; Brian Morgan; Reza Ghodssi20092009, vol.18, no.2
Variable-Size Solder Droplets by a Molten-Solder Ejection MethodYoshinori Yokoyama; Kazuyo Endo; Toshihiro Iwasaki; Hiroshi Fukumoto20092009, vol.18, no.2
Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate InterconnectKaran Kacker; Suresh K. Sitaraman20092009, vol.18, no.2
Precision In-Plane Hand Assembly of Bulk-Microfabricated Components for High-Voltage MEMS Arrays ApplicationsBlaise Gassend; Luis Fernando Velasquez-Garcia; Akintunde Ibitayo Akinwande20092009, vol.18, no.2
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