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期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：硅器件和材料
收藏年代2000～2023



全部

2000 2001 2002 2009 2013 2014
2015 2017 2020 2021 2022 2023

2000, vol.100, no.295 2000, vol.100, no.296 2000, vol.100, no.373 2000, vol.100, no.374 2000, vol.100, no.477 2000, vol.100, no.517
2000, vol.100, no.603 2000, vol.100, no.652 2000, vol.100, no.653 2000, vol.100, no.668

题名作者出版年年卷期
Critical issues of ULSI multilevel interconnect technologyTakamaro Kikkawa20002000, vol.100, no.603
Process design methodology for via-shape-controlled, Cu dual-damascene interconnects tailored in low-k organic filmYoshihiro Hayashi; Keizo Kinoshita; Munehiro Tada; Tatsuya Usami; Masayuki Hiroi; Takashi Tonegawa; Kazutoshi Shiba; Takahiro Onodera; Masayoshi Tagami; Shinobu Saitoh20002000, vol.100, no.603
Thick on-chip interconnections by Cu-damascene processes using a photosensitive polymerKunio Saito; Shoji Yagi; Toshihiko Kosugi; Chikara Yamaguchi; Kazuhisa Kudo; Masaki Yano; Hiromu Ishii; Katsuyuki Machida; Hakaru Kyuragi20002000, vol.100, no.603
Evolution of grain and micro-void structure in electroplated copper interconnection linesA. Hobbs; S. Murakami; T. Hosoda; S. Ohtsuka; M. Miyajima; S. Sugatani; T. Nakamura20002000, vol.100, no.603
Dielectric breakdown in damascene Cu interconnectionKen-ichi Takeda; Kenji Hinode20002000, vol.100, no.603
Effect of phosphorous-doped low-k dielectric films on copper ion driftT. Oda; S. Mukaigawa; T. Aoki; O. Funayama; T. Kikkawa20002000, vol.100, no.603
In situ chemical vapor deposition manufacturing processes of barrier/copper seed films for electroplatingAtsushi Sekiguchi; Tomoaki Koide; Minjuan Zhang; Takafumi Kuninobu; Hideki Sunayama; Akiko Kobayashi; Kaoru Suzuki; Shiqin Xiao; Osamu Okada20002000, vol.100, no.603
Theoretical derivation of dielectric constant for low-k materials aiming to k<1.5 interconnects processTakuya Fukuda; Nobuo Aoi; Azuma Matsuura; Hironori Matsunaga20002000, vol.100, no.603
Film characterization of semiconductor SiLK dielectric resin for BEOL integration processY. Ida; A. Oshima; J. Waeterloos; M. Mills; E. Shaffer; C. Mohler; D. Castillo; P. Townsend; M. Radler; K. Foster; T. Narita20002000, vol.100, no.603
Novel silica film with an ordered periodic pore structureHirohiko Murakami; Takahiro Nakayama; Hiroyuki Yamakawa; Kazuhiro Yamada; Nobuaki Seki; Kouichi Tamagawa20002000, vol.100, no.603



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