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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization MethodW. A. Khan; J. R. Culham; M. M. Yovanovich20082008, vol.130, no.3
Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed ChannelsE. Elsaadawy; H. Mortazavi; M. S. Hamed20082008, vol.130, no.3
A Numerical Study of a Heat Sink Fin Under a Laminar Impinging JetZ. Q. Lou; C. Yap; A. S. Mujumdar20082008, vol.130, no.3
A Convection/Radiation Temperature Control System for High Power Density Electronic Device TestingMatthew Sweetland; John H. Lienhard V; Alexander H. Slocum20082008, vol.130, no.3
Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art ReviewHamid Hadim; Tohru Suwa20082008, vol.130, no.3
Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal AnalysesJin Yang; I. Charles Ume20082008, vol.130, no.3
An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock LoadsFadi Alsaleem; Mohammad I. Younis; Ronald Miles20082008, vol.130, no.3
Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder JointsHao Lu; Chun Yu; Peilin Li; Junmei Chen20082008, vol.130, no.3
A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element MethodSiva P. Gurrum; Yogendra K. Joshi; William P. King; Koneru Ramakrishna; Martin Gall20082008, vol.130, no.3
Hierarchal Modeling of Creep Behavior of SnAg Solder AlloysMin Pei; Jianmin Qu20082008, vol.130, no.3
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