长垣产业园区科技文献服务平台 | cy.gmachineinfo.com

期刊

ISSN	1043-7398
刊名	Journal of Electronic Packaging
参考译名	电子封装杂志；美国机械工程师学会汇刊
收藏年代	1995～2023

全部

1995	1996	1997	1998	1999	2000
2001	2002	2003	2004	2005	2006
2007	2008	2009	2010	2011	2012
2013	2014	2015	2016	2017	2018
2019	2020	2021	2022	2023

2002, vol.124, no.1

2002, vol.124, no.2

2002, vol.124, no.3

2002, vol.124, no.4

题名

作者

出版年

年卷期

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Marc Hodes; Randy D. Weinstein; Stephen J. Pence; Jason M. Piccini; Lou Manzione; Calvin Chen

2002

2002, vol.124, no.4

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad; Suresh K. Sitaraman

2002

2002, vol.124, no.4

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau; Z. Mei; S. Pang; C. Amsden; J. Rayner; S. Pan

2002

2002, vol.124, no.4

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang; Y. C. Chan; K. C. Hung; P. L. Tu

2002

2002, vol.124, no.4

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan; C. P. Malhotra; R. K. Sharma

2002

2002, vol.124, no.4

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae

2002

2002, vol.124, no.4

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau; C. L. Jiaa; S. J. Erasmus

2002

2002, vol.124, no.4

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung

2002

2002, vol.124, no.4

Study of P-V-T-C Relation of EMC

Yi-San Chang; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang

2002

2002, vol.124, no.4

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel

2002

2002, vol.124, no.4