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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
The mechanics of the edge delamination testBoris Mirman19951995, vol.117, no.4
Simulation of heat transfer in a reflow soldering oven with air and nitrogen injectionY. S. Son; T. L. Bergman; M. T. Hyun19951995, vol.117, no.4
Review of heat transfer technologies in electronic equipmentL. T. Yeh19951995, vol.117, no.4
Optima; chip layout on a printed circuit board using design sensitivity analysis of subdomain configurationSeo Jin Joo; Byung Man Kwak19951995, vol.117, no.4
Natural convection in shallow, horizontal air layers encountered in electronic coolingElias Papanicolaou; Sridhar Gopalakrishna19951995, vol.117, no.4
Integrated infrared failure analysis of printed circuit boardsJ. J. Miles; C. R. Zelak; J. M. Kliman; J. E. Sunderland19951995, vol.117, no.4
Effect of wall conduction on natural convection in an enclosure with a centered heat sourceYi-Hsiang Huang; Suresh K. Aggarwal19951995, vol.117, no.4
Computations for a three-by-three array of protrusions cooled by liquid immersion: effect of substrate thermal conductivityD. Mukutmoni; Y. K. Joshi; M. D. Kelleher19951995, vol.117, no.4
Comparison of two-phase electronic cooling using free jets and spraysKurt A. Estes; Issam Mudawar19951995, vol.117, no.4
Cleaning and reflow of Pb-Sn C4 solder bumpsCaroline S. Lee; Doug C. Crafts; T. W. Eagar19951995, vol.117, no.4
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