长垣产业园区科技文献服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2020, vol.142, no.1 2020, vol.142, no.2 2020, vol.142, no.3 2020, vol.142, no.4

题名作者出版年年卷期
An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology LoadsKhalili, Sadegh; Rangarajan, Srikanth; Gektin, Vadim; Alissa, Husam; Sammakia, Bahgat20202020, vol.142, no.4
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle ChargerTayyara, Omri; Silva, Carlos Da; Nasr, Miad; Assadi, Amir; Gupta, Kshitij; Trescases, Olivier; Amon, Cristina H.20202020, vol.142, no.4
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics CoolingChristidis, Pavolas N.; Vayas Tobar, Nicolas; Talmor, Michal; Yagoobi, Jamal; Castaneda, Alexander J.; O'Connor, Nathaniel J.20202020, vol.142, no.4
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and OptimizationWhitt, Reece; Huitink, David; Yuan, Zhao; Emon, Asif; Luo, Fang; Hudson, Skyler20202020, vol.142, no.4
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated CircuitsRangarajan, Srikanth; Hadad, Yaser; Choobineh, Leila; Sammakia, Bahgat20202020, vol.142, no.4
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive LoadsDale, Travis; Singh, Yuvraj; Bernander, Ian; Subbarayan, Ganesh; Handwerker, Carol; Su, Peng; Glasauer, Bernard20202020, vol.142, no.4
A System to Package Perspective on Transient Thermal Management of Electronicsde Bock, H. Peter; Huitink, David; Shamberger, Patrick; Lundh, James Spencer; Choi, Sukwon; Niedbalski, Nicholas; Boteler, Lauren20202020, vol.142, no.4
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride SubstratesSong, Yiwen; Lundh, James Spencer; Wang, Weijie; Leach, Jacob H.; Eichfeld, Devon; Krishnan, Anusha; Perez, Carlos; Ji, Dong; Borman, Trent; Ferri, Kevin; Maria, Jon-Paul; Chowdhury, Srabanti; Foley, Brian M.; Choi, Sukwon; Ryou, Jae-Hyun20202020, vol.142, no.4
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change MaterialsNafis, Bakhtiyar Mohammad; Iradukunda, Ange-Christian; Huitink, David20202020, vol.142, no.4
Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body MeasurementsLall, Pradeep; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei; Thomas, Tony20202020, vol.142, no.4
1234567



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024