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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2012, vol.134, no.1 2012, vol.134, no.2 2012, vol.134, no.3 2012, vol.134, no.4

题名作者出版年年卷期
Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip CoolingGongnan Xie; Jian Liu; Weihong Zhang; Bengt Sunden20122012, vol.134, no.4
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy EfficiencyThomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Niru Kumari; Tahir Cader20122012, vol.134, no.4
Reliability Assessment of Preloaded Solder Joint Under Thermal CyclingDa Yu; Hohyung Lee; Seungbae Park20122012, vol.134, no.4
Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board LevelD. N. Borza; I. T. Nistea20122012, vol.134, no.4
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating EfficiencyThomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Brandon Rubenstein; Scot Heath; Niru Kumari20122012, vol.134, no.4
Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling ApplicationsA. F. M. Arif; Syed M. Zubair; S. Pashah20122012, vol.134, no.4
Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt NumbersDae Hee Lee; Jong Ryeol Bae; Mira Ryu; Phil Ligrani20122012, vol.134, no.4
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver PasteYi Yan; Xu Chen; Xingsheng Liu; Yunhui Mei; Guo-Quan Lu20122012, vol.134, no.4
Pull Force and Displacement of Cu/Au Wire InterconnectsJ. Lau; S. Wu; J. M. Lau20122012, vol.134, no.4
Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics CoolingErcan M. Dede20122012, vol.134, no.4
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