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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic ModelWei Han; Marc Rensing; Peter O'Brien; Frank H. Peters20112011, vol.133, no.4
A Creep Model for Solder AlloysYongchang Lee; Cemal Basaran20112011, vol.133, no.4
Thermal Modeling Technique for Multiple Transistors Within Silicon ChipTohru Suwa; Hamid Hadim20112011, vol.133, no.4
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature ChangeD. Sujan; Dereje E. Woldemichael; M. V. V. Murthy; K. N. Seetharamu20112011, vol.133, no.4
Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test SimulationsEtienne L. Bonnaud20112011, vol.133, no.4
Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation ResultsA. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta20112011, vol.133, no.4
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic SystemsVikram Venkatadri; Bahgat Sammakia; Krishnaswami Srihari; Daryl Santos20112011, vol.133, no.4
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental ResultsA. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta20112011, vol.133, no.4
Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid MetalPeipei Li; Jing Liu20112011, vol.133, no.4
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting MediumG. Lorenzini; C. Biserni; L. A. Isoldi; E. D. dos Santos; L. A. O. Rocha20112011, vol.133, no.4
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