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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001 2002 2003 2004 2005 2006
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2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024


题名作者出版年年卷期
Modeling the Thermal-Compression Flip-Chip Process by Finite Element AnalysisHuang, Yue; Li, Shang-Shu; Gao, Yan-Pei; Zhu, Hai-Bin; He, Gao-Yin; Xie, Xiao-Hui; Lin, Chun20242024, vol.146, no.3
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With HotspotsFarahikia, Mahdi; Wang, Ping-Chuan; Reyes, Louis; Krumholtz, Matthew20242024, vol.146, no.3
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature ExposureLall, Pradeep; Pandurangan, Aathi Raja Ram; Blecker, Ken20242024, vol.146, no.3
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal AgingLall, Pradeep; Mehta, Vishal; Suhling, Jeff; Blecker, Ken20242024, vol.146, no.3
Forward Kinematics Analysis of High-Precision Optoelectronic Packaging PlatformWang, Ziyang; Zhou, Haibo; Xiao, Linjiao; Duan, Lian20242024, vol.146, no.3
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain GaugesWang, Y. W.; Tsai, M. Y.; Chou, Y. S.20242024, vol.146, no.3
Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural NetworkZhang, Liwen; Yang, Chen; Yang, He; Wang, Jinchan; Zhang, Jincan20242024, vol.146, no.3
Hybrid Bonding for Ultra-High-Density InterconnectLu, Mei-Chien20242024, vol.146, no.3
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic PackagingShih, Meng-Kai; Lin, Guan-Sian; Yang, Jonny20242024, vol.146, no.3
Characterization of a Rack-Level Thermosyphon-Based Cooling SystemKhalid, R.; Schon, S. G.; Amalfi, R. L.; Ortega, A.; Wemhoff, A. P.20242024, vol.146, no.3
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