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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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题名作者出版年年卷期
Heat Dissipation Design Based on Topology Optimization and Auxiliary MaterialsChen, Jiawei; Yan, Zhongming; Qiao, Yang; Lin, Feihong; Wang, Yu; Zhou, Hongcheng20242024, vol.146, no.2
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper PlatformLin, Yujui; Wei, Tiwei; Moy, Wyatt Jason; Chen, Hao; Gupta, Man Prakash; Degner, Michael; Asheghi, Mehdi; Goodson, Kenneth E.; Mantooth, H. Alan20242024, vol.146, no.2
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision TechnologyWang, Tongju; Liu, Yahao; Zhang, Wenqian; Lei, Yongping; Lin, Jian; Fu, Hanguang; Lin, Zipeng20242024, vol.146, no.2
Hybrid Substrates for Heterogeneous IntegrationLau, John H.; Chen, Gary Chang-Fu; Yang, Channing Cheng-Lin; Teng, Vincent; Peng, Andy Yan-Jia; Huang, Jones Yu-Cheng; Liu, Hsing-Ning; Chen, Y. H.; Tseng, Tzyy-Jang; Li, Ming20242024, vol.146, no.2
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level CoolingKhalid, R.; Youssef, E.; Amalfi, R. L.; Wemhoff, A. P.; Ortega, A.20242024, vol.146, no.2
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device ApplicationsKumar, Amit; Majumder, Ayan; Cardenas, Ruander; Macdonald, Mark; Bhattacharya, Anandaroop20242024, vol.146, no.2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip WarpageCai, Chongyang; Wang, Huayan; Yang, Junbo; Yin, Pengcheng; Park, S. B.20242024, vol.146, no.2
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat SinkOsman, Ammar; Moreno, Gilberto; Myers, Steve; Major, Joshua; Feng, Xuhui; Narumanchi, Sreekant V. J.; Joshi, Yogendra20242024, vol.146, no.2
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue LifeHa, Jonghwan; Lai, Yangyang; Yang, Junbo; Yin, Pengcheng; Park, Seungbae20242024, vol.146, no.2
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G MethodLall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David20242024, vol.146, no.2
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