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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-AssemblyM. Mastrangeli; K. Jans; T. Steylaerts; C. Van Hoof; J. P. Celis20102010, vol.132, no.4
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp WavesKen-ichi Ohguchi; Katsuhiko Sasaki20102010, vol.132, no.4
An Investigation of Flat-Plate Oscillating Heat PipesPeng Cheng; Scott Thompson; Joe Boswell; H. B. Ma20102010, vol.132, no.4
On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic GeneratorWuwei Feng; Qingfeng Meng; Youbo Xie; Hong Fan20102010, vol.132, no.4
Thermal Conductivity of Diamond-Containing GreaseHung-En Chou; Shang-Ray Yang; Sea-Fue Wang; James C. Sung20102010, vol.132, no.4
Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic SubstratesK. N. Prabhu; G. Kumar20102010, vol.132, no.4
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive FilmJianhua Zhang; Jinsong Zhang; Lianqiao Yang20102010, vol.132, no.4
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp WavesKen-ichi Ohguchi; Katsuhiko Sasaki20102010, vol.132, no.4
Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball BondingM. F. Rosle; S. Abdullah; M. A. A. Hamid; A. R. Daud; A. Jalar; Z. Kornain20102010, vol.132, no.4
Successive Softening and Cyclic Damage in Viscoplastic MaterialLeila J. Ladani20102010, vol.132, no.4
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