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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Design Optimization for Pin-Fin Heat SinksHan-Ting Chen; Po-Li Chen; Jenn-Tsong Horng; Ying-Huei Hung20052005, vol.127, no.4
A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic SystemSatish Radhakrishnan; Ganesh Subbarayan; Luu Nguyen; William P. Mazotti20052005, vol.127, no.4
A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear LoadingYutaka Tsukada; Hideo Nishimura; Hiroki Yamamoto; Masao Sakane20052005, vol.127, no.4
Time-Dependent Rheological Behavior of Fluids For Electronics PackagingX. B. Chen20052005, vol.127, no.4
Behavior of Anisotropic Conductive Film (ACF) Joint Under Mechanical ShockRashed Adnan Islam; Y. C. Chan20052005, vol.127, no.4
Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE AnalysisQian Zhang; Abhijit Dasgupta; Dave Nelson; Hector Pallavicini20052005, vol.127, no.4
Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder AlloyM. N. Islam; Y. C. Chan; M. O. Alam; A. Sharif20052005, vol.127, no.4
A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat SinksWeilin Qu; Issam Mudawar20052005, vol.127, no.4
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer FilmsK. M. B. Jansen; V. Gonda; L. J. Ernst; H. J. L. Bressers; G. Q. Zhang20052005, vol.127, no.4
Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn-36%Pb-2%Ag Solder Ball Arrays in Commercial Area Array Packages at -40℃, 23℃, and 125℃Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontial; Antonio Paesano; Subhotosh Khan; John W. Gillespie, Jr.20052005, vol.127, no.4
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