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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2019 2020 2021 2022 2023

2019, vol.141, no.1 2019, vol.141, no.2 2019, vol.141, no.3 2019, vol.141, no.4

题名作者出版年年卷期
Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle ContainmentZhang, Mingrui; Long, Zhengwei; An, Qingsong; Sun, Chao; Zhang, Hao; Cheng, Xionglei; Li, Xiaowei20192019, vol.141, no.4
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder JointSu, Sinan; Akkara, Francy John; Thaper, Ravinder; Alkhazali, Atif; Hamasha, Mohammad; Hamasha, Sa'd20192019, vol.141, no.4
Thermal Control Strategies for Reliable and Energy-Efficient Data CentersKhalid, Rehan; Wemhoff, Aaron P.20192019, vol.141, no.4
Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging TechnologiesPeng, Yang; Liang, Renli; Mou, Yun; Dai, Jiangnan; Chen, Mingxiang; Luo, Xiaobing20192019, vol.141, no.4
Recent Advances and Trends in Fan-Out Wafer/Panel-Level PackagingLau, John H.20192019, vol.141, no.4
Numerical Investigation of Shape Effect on Microdroplet EvaporationShan, Li; Shuai, Shuai; Ma, Binjian; Du, Zichen; Dogruoz, Baris; Agonafer, Damena20192019, vol.141, no.4
Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate PasteCheng, Hao; Peng, Yang; Mou, Yun; Sun, Qinglei; Chen, Mingxiang20192019, vol.141, no.4
Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- andBi-Axial Loading and Free Edge StressesTsai, M. Y.; Chen, H. J.; Yeh, J. H.20192019, vol.141, no.4
Embedded Cooling for Wide Bandgap Power Amplifiers: A ReviewBar-Cohen, A.; Maurer, J. J.; Altman, D. H.20192019, vol.141, no.4
Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode PackagingLi, Jia-Sheng; Tang, Yong; Li, Zong-Tao; Kang, Wen-Quan; Ding, Xin-Rui; Yu, Bin-Hai20192019, vol.141, no.4
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