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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Steady-State Behavior of a Three-Dimensional Pool-Boiling SystemMichel Speetjens20082008, vol.130, no.4
Microscale and Nanoscale Thermal Characterization TechniquesJ. Christofferson; K. Maize; Y. Ezzahri; J. Shabani; X. Wang; A. Shakouri20082008, vol.130, no.4
Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill MaterialsSaketh Mahalingam; Ananth Prabhakumar; Sandeep Tonapi; Suresh K. Sitaraman20082008, vol.130, no.4
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal CyclingS. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung20082008, vol.130, no.4
Electromigration Reliability With Respect to Cu Weight Contents of Sn-Ag-Cu Flip-Chip Solder Joints Under Comparatively Low Current StressingYi-Shao Lai; Ying-Ta Chiu20082008, vol.130, no.4
Design for Reliability Applied to Packaging of a MOEMS SwitchAbiodun A. Fasoro; Manoj Mittal; Dan O. Popa; Dereje A. Agonafer; Harry E. Stephanou20082008, vol.130, no.4
An Alternative Method for the Cooling of Power Microelectronics Using Classical RefrigerationVictor Chiriac; Florea Chiriac20082008, vol.130, no.4
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin SpacesKarl J. L. Geisler; Avram Bar-Cohen20082008, vol.130, no.4
Flip-Chip Interconnect for Coplanar Strip LinesYoung K. Song; Chin C. Lee20082008, vol.130, no.4
Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat SinkWataru Nakayama20082008, vol.130, no.4
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