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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

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2001 2002 2003 2004 2005 2006
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1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
Comparison of LCC solder joint life predictions with experimental dataLiang-chi Wen; Ronald G. Ross, Jr.19951995, vol.117, no.2
Creep crack growth prediction of solder joints during -- an engineering approachAhmer R. Syed19951995, vol.117, no.2
Energy approach to the fatigue of 60/40 solder: part I -- influence of temperature and cycle frequencyH. D. Solomon; E. D. Tolksdorf19951995, vol.117, no.2
Evaluation of design parameters for leadless chip resistors solder jointsEdward Jih; Yi-Hsin Pao19951995, vol.117, no.2
Interfacial thermal stresses in layered structures: the stepped edge problemWan-Lee Yin19951995, vol.117, no.2
Modeling solder joint fatigue life for gull-wing leaded packages: part I -- elastic plastic stress modelV. K. Gupta; D. B. Barker19951995, vol.117, no.2
On Murphy's integrated circuit yield integralJohn H. Lau19951995, vol.117, no.2
Plastic deformation kinetics of 95.5Sn4Cu0.5Ag solder jointsZ. Guo; Yi-Hsin Pao; H. Conrad19951995, vol.117, no.2
Plastic deformation of solder joints kin pin grid arrays subjected to thermal stressPeter A. Engel; Shou-Chien Chou19951995, vol.117, no.2
Reliability issues in plated-through-holes due to insertion-mount compliant-pin connectorsG. Ganguly; A. Dasgupta19951995, vol.117, no.2
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