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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2004, vol.126, no.1 2004, vol.126, no.2 2004, vol.126, no.3 2004, vol.126, no.4

题名作者出版年年卷期
The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly PackagingSamuel I-En Lin20042004, vol.126, no.3
Reducing Warpage of Printed Circuit Boards by Using Wavy TracesParsaoran Hutapea; Joachim L. Grenestedt20042004, vol.126, no.3
Two-Phase Flow and Heat Transfer in Rectangular Micro-ChannelsWeilin Qu; Seok-Mann Yoon; Issam Mudawar20042004, vol.126, no.3
Interfacial Fracture Toughness Measurement of a Ti/Si InterfaceMitul Modi; Suresh K. Sitaraman20042004, vol.126, no.3
Thermal Management of Transient Power Spikes in Electronics - Phase Change Energy Storage or Copper Heat Sinks?Shankar Krishnan20042004, vol.126, no.3
Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic ComponentsHiroshi Honda; ZhengGuo Zhang; Nobuo Takata20042004, vol.126, no.3
The Thermoelastic Analysis of Chip-Substrate SystemLinzhi Wu20042004, vol.126, no.3
Trade-off Design of Extruded Heat Sinks Using Mathematical OptimizationD. J. de Kock; J. A. Visser20042004, vol.126, no.3
Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat SinksDuckjong Kim; Sung Jin Kim; Alfonso Ortega20042004, vol.126, no.3
Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip AssembliesBart Vandevelde; Eric Beyne; Dirk Vandepitte; Martine Baelmans20042004, vol.126, no.3
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