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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2021, vol.33, no.1 2021, vol.33, no.2 2021, vol.33, no.3 2021, vol.33, no.4 2021, vol.33, no.5

题名作者出版年年卷期
Optimized cerium addition for microstructure and mechanical properties of SAC305Muhammad, Riaz; Ali, Umair20212021, vol.33, no.4
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in GhanaNyarko, Frank Kwabena Afriyie; Takyi, G.20212021, vol.33, no.4
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperatureGan, Gui-sheng; Jiang, Liujie; Chen, Shiqi; Deng, Yongqiang; Yang, Donghua; Jiang, Zhaoqi; Tian, Mizhe; Xu, Qianzhu; Liu, Xin; Cao, Huadong20212021, vol.33, no.4
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder jointsHan, Xu; Li, Xiaoyan; Yao, Peng; Chen, Dalong20212021, vol.33, no.4
Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic soldersLin, Chung-Yung20212021, vol.33, no.4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systemsSiswanto, Waluyo Adi; Borodin, Kirill; Mahmoud, Zaid Hamid; Surendar, A.; Sajjadifar, Sami; Abdilova, Galiya; Chang, Jun20212021, vol.33, no.4



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