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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2013, vol.25, no.1 2013, vol.25, no.2 2013, vol.25, no.3 2013, vol.25, no.4

题名作者出版年年卷期
Ultra-short vertically aligned carbon nanofibers transfer and application as bonding materialSi Chen20132013, vol.25, no.4
A review: influence of nano particles reinforced on solder alloyErvina Efzan Mhd Noor; Amares Singh; Yap Tze Chuan20132013, vol.25, no.4
A study into the re-processing of pure tin termination finishes into tin-leadIan C. Turner; Barrie D. Dunn; Cathy Barnes20132013, vol.25, no.4
Cu filling of TSV using various current forms for three-dimensional packaging applicationMyong-Hoon Roh; Jun-Hyeong Lee; Wonjoong Kim; Jea Pil Jung20132013, vol.25, no.4
SAC solder paste with carbon nanotubes Part II: carbon nanotubes' effect on solder joints' mechanical properties and microstructureKrystyna Bukat; Janusz Sitek; Marek Koscielski; Wojciech Niedzwiedz; Anna Mlozniak; Malgorzata Jakubowska20132013, vol.25, no.4
Comparison study of SAC405 and SAC405 + 0.1%Al lead free soldersRoman Kolenak; Robert Augustin; Maros Martinkovic; Michal Chachula20132013, vol.25, no.3
The behaviour of solder pastes in stencil printing with electropolishing processYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20132013, vol.25, no.3
An alternative JEDEC test board design and analysisFang Liu; Guang Meng; Junfeng Zhao20132013, vol.25, no.3
Filling analyses of solder paste in the stencil printing process and its application to process designWon-Sang Seo; Jong-Bong Kim20132013, vol.25, no.3
Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solderHuan Ye; Songbai Xue; Cheng Chen; Yang Li20132013, vol.25, no.3
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