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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2005 2006 2007 2008 2009 2010
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2023

2004, vol.16, no.1 2004, vol.16, no.2 2004, vol.16, no.3

题名作者出版年年卷期
Dissolution of solids in contact with liquid solderSamjid Mannan; Michael P. Clode20042004, vol.16, no.3
A comparison of the quality of lead-free solder pastesJanusz Sitek; Dubravka Rocak; Krystyna Bukat; Janeta Fajfar-Plut; Darko Belavic20042004, vol.16, no.3
A study of SMT assembly processes for fine pitch CSP packagesMinna Arra; David Geiger; Jonas Sjoberg20042004, vol.16, no.3
Dissolution rates of iron plating on soldering iron tips in molten lead-free soldersTadashi Takemoto; Takashi Uetani; Morio Yamazaki20042004, vol.16, no.3
Thermal cycling reliability of lead-free chip resistor solder jointsJeffrey C. Suhling; H. S. Gale; R. Wayne Johnson; M. Nokibul Islam; Tushar Shete; Pradeep Lall; Michael J. Bozack; John L. Evans; Ping Seto; Tarun Gupta; James R. Thompson20042004, vol.16, no.2
Strategies for improving the reliability of solder joints on power semiconductor devicesGuo-Quan Lu; Xingsheng Liu; Sihua Wen; Jesus Noel Calata; John G. Bai20042004, vol.16, no.2
CBGA solder joint thermal fatigue life estimation by a simple methodI. E. Wong; C. Y. Lau H. S. Fenger20042004, vol.16, no.2
Long term mechanical reliability with lead-free soldersW. J. Plumbridge20042004, vol.16, no.2
Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrateEric C. C. Van; S.W. Ricky Lee; X. Huang20042004, vol.16, no.2
Reliability testing and data analysis of lead-free solder joints for high-density packagesJohn Lau; Nick Hoo; Rob Horsley; Joe Smetana; Dongkai Shangguan; Walter Dauksher; Dave Love; Irv Menis; Bob Sullivan20042004, vol.16, no.2
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