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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
Workmanship standards and their application on ESA projectsBarrie D. Dunn20082008, vol.20, no.4
Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additivesToshihiro Miyake; Masaru Ishida; Satoshi Inagaki20082008, vol.20, no.4
Thermal profiling: a reflow process based on the heating factorJin Gang Gao; Yi Ping Wu; Han Ding; Nian Hong Wan20082008, vol.20, no.4
Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVAK. Bukat; J. Sitek; R. Kisiel; Z. Moser; W. Gasior; M. Koscielski; J. Pstrus20082008, vol.20, no.4
Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloysM. Reid; J. Punch; M. Collins; C. Ryan20082008, vol.20, no.4
Silver thick film pastes for low temperature co-fired ceramics: impact of glass frit variationJayashri Bangali; Sunit Rane; Girish Phatak; Shashikala Gangal20082008, vol.20, no.3
Solder paste characterisation: towards the development of quality control (QC) toolR. Durairaj; S. Mallik; N. N. Ekere20082008, vol.20, no.3
A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environmentChristopher M. Greene; Krishnaswami Srihari20082008, vol.20, no.3
Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPsMeng-Kuang Huang; Chiapyng Lee20082008, vol.20, no.3
Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assemblyO. Nousiainen; T. Kangasvieri; R. Rautioaho; J. Vahakangas20082008, vol.20, no.3
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