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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2004, vol.16, no.1 2004, vol.16, no.2 2004, vol.16, no.3

题名作者出版年年卷期
Design for lead-free solder joint reliability of high-density packagesJohn Lau; Walter Dauksher; Joe Smetana; Rob Horsley; Dongkai Shangguan; Todd Castello; Irv Menis; Dave Love; Bob Sullivan20042004, vol.16, no.1
Reflow profile study of the Sn-Ag-Cu solderB. Salam; C. Virseda; H. Da; N. N. Ekere; R. Durairaj20042004, vol.16, no.1
Characterization of mechanical performance of Sn/Ag/Cu solders joints with different component lead coatingsMinna Arra; Todd Castello; Dongkai Shangguan; Eero Ristolainen20042004, vol.16, no.1
The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowTimo Liukkonen; Pekka Nummenpaa; Aulis Tuominen20042004, vol.16, no.1
Thermal fatigue cracking of surface mount conductive adhesive jointsZhimin Mo; Zonghe Lai; Shiming Li; Johan Liu20042004, vol.16, no.1
Design, materials and process for lead-free assembly of high-density packagesJoe Smetana; Rob Horsley; John Lau; Ken Snowdon; Dongkai Shangguan; Jerry Gleason; Irv Memis; Dave Love; Walter Dauksher; Bob Sullivan20042004, vol.16, no.1



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