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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2011, vol.23, no.1 2011, vol.23, no.2 2011, vol.23, no.3 2011, vol.23, no.4

题名作者出版年年卷期
Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part I - generic mechanical design procedureNecdet Geren; Cagdas Sarigul; Melih Bayramoglu20112011, vol.23, no.4
Process characterization and reliability for the assembly of 01005 chip componentsYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20112011, vol.23, no.4
Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand-off heightsBo Wang; Fengshun Wu; Yiping Wu; Liping Mo; Weisheng Xia20112011, vol.23, no.4
Wettability and shear strength of active Sn2Ti solder on Al_2O_3 ceramicsRoman Kolenak; Michal Chachula; Pavol Sebo; Monika Kolenakova20112011, vol.23, no.4
The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reductionChien-Yi Huang; Yueh-Hsun Lin; Kuo-Ching Ying; Chen-Liang Ku20112011, vol.23, no.4
Occurrence of tin pest on the surface of tin-rich lead-free alloysAgata Skwarek; Marcin Sroda; Mariusz Pluska; Andrzej Czerwinski; Jacek Ratajczak; Krzysztof Witek20112011, vol.23, no.3
Tensile strength of fine pitch QFP lead-free soldered joints with diode laser solderingPeng Xue; Song-bai Xue; Liang Zhang; Yi-fu Shen; Li-li Gao; Sheng-lin Yu; Hong Zhu; Zongjie Han; Yan Chen20112011, vol.23, no.3
Modifications of the 85/85 test and the temperature cycling test for tantalum capacitorsJohanna Virkki; Lauri Sydanheimo; Pasi Raumonen20112011, vol.23, no.3
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock testsJue Li; Hongbo Xu; Jussi Hokka; Toni T. Mattila; Hongtao Chen; Mervi Paulasto-Krockel20112011, vol.23, no.3
Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copperK. Bukat; M. Koscielski; J. Sitek; M. Jakubowska; A. Mlozniak20112011, vol.23, no.3
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