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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024


题名作者出版年年卷期
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder jointsJiang, Mengxia; Liu, Yang; Xue, Yuxiong; Shan, Guangbao; Lv, Jun; Huang, Mairui20242024, vol.36, no.4
Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB 2 substrateWang, Liuyong; Wu, Qi; Song, Ziming; Li, Yue; Li, Xuewen; Tu, Bing; Li, Yulong20242024, vol.36, no.4
Robust vision detection of pipeline solder jointsAn, Huijun; Kong, Lingbao20242024, vol.36, no.4
Investigating the impact of different solder alloy materials during laser soldering processBachok, Zuraihana; Abas, Aizat; Tang, Hooi Feng; Nazarudin, Muhammad Zaim Hanif; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che20242024, vol.36, no.4
Sn99Ag0.3Cu0.7-TiO 2 composite solder joints and their influence on thermal parameters of power componentsPietruszka, Adrian; Gorecki, Pawel; Skwarek, Agata20242024, vol.36, no.4
A temperature control method of hot-bar soldering based on extended Kalman filterZeng, Min; Xie, Jianxing; Li, Zhitao; Wei, Qincheng; Yang, Hui20242024, vol.36, no.3
Electric current stressing enhanced damping properties in Sn5Sb solderLiu, Linqiang; Chen, Feng; Li, Wangyun20242024, vol.36, no.3
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraintLi, Zhenkun; Zhao, Zhili; Liu, Jinliang; Ding, Xin20242024, vol.36, no.3
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solderLiu, Fang; Wang, Zilong; Zhou, JiaCheng; Wu, Yuqin; Wang, Zhen20242024, vol.36, no.3
A study on the thermomechanical response of various die attach metallic materials of power electronicsGharaibeh, Mohammad A.; Wilde, Juergen20242024, vol.36, no.3
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