长垣产业园区科技文献服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Local melt process of solder bumping by induction heating reflowHongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim20092009, vol.21, no.4
Reflow profile optimization of μBGA solder joints considering reflow temperature and time couplingTao Bo; Yin Zhouping; Ding Han; Wu Yiping20092009, vol.21, no.4
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered jointsJianbiao Pan; Tzu-Chien Chou; Jasbir Bath; Dennis Willie; Brian J. Toleno20092009, vol.21, no.4
On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersD. Di Maio; C. P. Hunt20092009, vol.21, no.4
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga soldersT. K. Yeh; K. L. Lin; B. Salam20092009, vol.21, no.4
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive jointsMartin Wickham; Ling Zou; Christopher Hunt20092009, vol.21, no.4
Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspectiveKati Kokko; Hanna Harjunpaa; Anna-Maija Haltia; Pekka Heino; Minna Kellomaki20092009, vol.21, no.4
Six sigma analysis of SMD feeding parameters and board assembly qualityPekka Kytosaho; Timo Liukkonen20092009, vol.21, no.3
Reliability analysis of a novel fan-out type WLPMing-Chih Yew; Mars Tsai; Dyi-Chung Hu; Wen-Kun Yang; Kuo-Ning Chiang20092009, vol.21, no.3
Composite coating structure in an implantable electronic deviceKati Kokko; Hanna Harjunpaa; Pekka Heino; Minna Kellomaki20092009, vol.21, no.3
123



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024