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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2012, vol.24, no.1 2012, vol.24, no.2 2012, vol.24, no.3 2012, vol.24, no.4

题名作者出版年年卷期
Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill filmTsung-Fu Yang; Kuo-Shu Kao; Ren-Chin Cheng; Jing-Yao Chang; Chau-Jie Zhan20122012, vol.24, no.4
Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solderPeng Xue; Songbai Xue; Yifu Shen; Zhengxiang Xiao; Hong Zhu; Weimin Long; Xinquan Yu20122012, vol.24, no.4
SAC 305 solder paste with carbon nanotubes - part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste propertiesK. Bukat; J. Sitek; M. Koscielski; M. Jakubowska; M. Sloma; A. Mlozniak; W. Niedzwiedz20122012, vol.24, no.4
Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloyDhafer Abdul Ameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che20122012, vol.24, no.4
Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder jointsWenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei20122012, vol.24, no.4
Surface finish effect on reliability of SAC 305 soldered chip resistorsMaurice N. Collins; Jeff Punch; Richard Coyle20122012, vol.24, no.4
The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing processLi-li Gao; Song-bai Xue; Hong Zhu20122012, vol.24, no.3
Mechanical durability of RFID chip joints assembled on flexible substratesKamil Janeczek; Tomasz Serzysko; Malgorzata Jakubowska; Grazyna Koziol; Anna Mlozniak20122012, vol.24, no.3
The effect of micro via-in pad designs on surface-mount assembly defects: Part I - TombstoningYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20122012, vol.24, no.3
Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N_2 or exposed to air atmosphereWei Liu; Yanhong Tian; Lei Yang; Chunqing Wang; Lining Sun20122012, vol.24, no.3
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