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期刊

ISSN	0954-0911
刊名	Soldering & Surface Mount Technology
参考译名	焊接与表面固定技术
收藏年代	1999～2023

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2023

2002, vol.14, no.1

2002, vol.14, no.2

2002, vol.14, no.3

题名

作者

出版年

年卷期

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

P. Towashiraporn; G. Subbarayan; B. McLlvanie; B. C. Hunter; D. Love; B. Sullivan

2002

2002, vol.14, no.3

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Shi-Wei Ricky Lee; Ben Hoi Wai Lui; Y. H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap

2002

2002, vol.14, no.3

Fatigue crack growth behavior of lead-containing and lead-free solders

Y. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai

2002

2002, vol.14, no.3

Low cycle fatigue and fatigue crack growth behavior of Sn-Ag eutectic solder

C. Kanchanomai; Y. Miyashita; Y. Mutoh; S. L. Mannan

2002

2002, vol.14, no.3

Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

L. C. Shiau; C. E. Ho; C. R. Kao

2002

2002, vol.14, no.3

Evaluation of two novel lead-free surface finishes

Richard Ludwig; Ning-Cheng Lee; Chonglun Fan; Yun Zhang

2002

2002, vol.14, no.3

Lead-free solder process implementation for PCB assembly

Peter Collier; Vasudivan Sunappan; Arulvanan Periannan

2002

2002, vol.14, no.3

Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging

C. M. Lawrence Wu; M. L. Chau

2002

2002, vol.14, no.2

Solder ball failure mechanisms in plastic ball grid array packages

C. H. Zhong; S. Yi; D. C. Whalley

2002

2002, vol.14, no.2

Reliability of tin-lead balled BGAs soldered with lead-free solder paste

Sami Tapani Nurmi; Eero Olavi Ristolainen

2002

2002, vol.14, no.2