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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

1999, vol.11, no.1 1999, vol.11, no.2 1999, vol.11, no.3

题名作者出版年年卷期
Survey of rework practices in the UK electronics assembly industryM. Wickham; C. P. Hunt19991999, vol.11, no.3
PBGA solder ball coplanarity impact evaluationTony Huang; Joe Chu19991999, vol.11, no.3
Materials behaviour and the reliability in performance of solder jointsW. J. Plumbridge19991999, vol.11, no.3
Interfacial reactions of tin-zinc-bismuth alloysPaul Harris19991999, vol.11, no.3
Enhancement of underfill encapsulants for flip-chip technologyM. B. Vincent; C. P. Wong19991999, vol.11, no.3
Characterization of a solder paste printing process and its optimizationGary K. K. Poon; D. J. Williams19991999, vol.11, no.3
Analysis of crack growth in solder jointsDongkai Shangguan19991999, vol.11, no.3
TMA, DMA, DSC and TGA of lead free soldersJohn H. Lau; Chris Chang19991999, vol.11, no.2
Surface insulation resistance (SIR) response to various processing parametersLing Zou; Christopher Hunt19991999, vol.11, no.2
Reduction of voiding in eutectic ball grid array solder jointsWilliam Casey19991999, vol.11, no.2
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