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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2004, vol.16, no.1 2004, vol.16, no.2 2004, vol.16, no.3

题名作者出版年年卷期
Failure analysis of lead-free solder joints for high-density packagesJohn Lau; Dongkai Shangguan; Todd Castello; Rob Horsley; Joe Smetana; Nick Hoo; Walter Dauksher; Dave Love; Irv Menis; Bob Sullivan20042004, vol.16, no.2
Reliability testing and data analysis of lead-free solder joints for high-density packagesJohn Lau; Nick Hoo; Rob Horsley; Joe Smetana; Dongkai Shangguan; Walter Dauksher; Dave Love; Irv Menis; Bob Sullivan20042004, vol.16, no.2
Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrateEric C. C. Van; S.W. Ricky Lee; X. Huang20042004, vol.16, no.2
Long term mechanical reliability with lead-free soldersW. J. Plumbridge20042004, vol.16, no.2
CBGA solder joint thermal fatigue life estimation by a simple methodI. E. Wong; C. Y. Lau H. S. Fenger20042004, vol.16, no.2
Strategies for improving the reliability of solder joints on power semiconductor devicesGuo-Quan Lu; Xingsheng Liu; Sihua Wen; Jesus Noel Calata; John G. Bai20042004, vol.16, no.2
Thermal cycling reliability of lead-free chip resistor solder jointsJeffrey C. Suhling; H. S. Gale; R. Wayne Johnson; M. Nokibul Islam; Tushar Shete; Pradeep Lall; Michael J. Bozack; John L. Evans; Ping Seto; Tarun Gupta; James R. Thompson20042004, vol.16, no.2



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