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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2021, vol.33, no.1 2021, vol.33, no.2 2021, vol.33, no.3 2021, vol.33, no.4 2021, vol.33, no.5

题名作者出版年年卷期
Automatic optical inspection system for IC solder joint based on local-to-global ensemble learningChen, Wenjie; Cai, Nian; Wang, Huiheng; Lin, Jianfa; Wang, Han20212021, vol.33, no.2
An experimental study of carbonyl powder power inductor cracking during reflow processRehman, Faisal; Asghar, Rafiq; Iqbal, Kashif; Aman, Ali; Nawaz, Agha Ali20212021, vol.33, no.2
Spatial analysis of underfill flow in flip-chip encapsulationNg, Fei Chong; Zawawi, Mohd Hafiz; Abas, Mohamad Aizat20212021, vol.33, no.2
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfacesMohamed Anuar, Rabiatul Adawiyah; Osman, Saliza Azlina20212021, vol.33, no.2
An investigation on function of current type on solder joint degradation in electronic packagesCai, Wenhui; Huang, Fei; Liu, Kai; Alaazim, Mohammed20212021, vol.33, no.2
Application of multi-quality parameter design in the optimization of underfilling process - a case study of a vehicle electronic moduleHuang, Chien-Yi; Shen, Li-Cheng; Wu, Ting-Hsuan; Greene, Christopher20212021, vol.33, no.2
Property of Sn-37Pb solder bumps with different diameter during thermal shockGan, Guisheng; Yang, Donghua; Wu, Yi-ping; Liu, Xin; Sun, Pengfei; Xia, Daquan; Cao, Huadong; Jiang, Liujie; Tian, Mizhe20212021, vol.33, no.2



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