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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2020, vol.32, no.1 2020, vol.32, no.2 2020, vol.32, no.3 2020, vol.32, no.4

题名作者出版年年卷期
Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature agingBangyao Han; Fenglian Sun; Tianhui Li; Yang Liu20202020, vol.32, no.2
Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solderRamani Mayappan; Amirah Salleh; Nurul Atiqah Tokiran; N. A. Awang20202020, vol.32, no.2
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered jointYun Liu; Weiyuan Yu; Xuemin Sun; Fengfeng Wang20202020, vol.32, no.2
Machine learning framework for predicting reliability of solder jointsSung Yi; Robert Jones20202020, vol.32, no.2
Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliabilityKamila Piotrowska; Feng Li; Rajan Ambat20202020, vol.32, no.2
Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDsMuna Raypah; Mutharasu Devarajan; Shahrom Mahmud20202020, vol.32, no.2
A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronicsMuhammad Aamir; Riaz Muhammad; Majid Tolouei-Rad; Khaled Giasin; Vadim V. Silberschmidt20202020, vol.32, no.2



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