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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2020, vol.32, no.1 2020, vol.32, no.2 2020, vol.32, no.3 2020, vol.32, no.4

题名作者出版年年卷期
Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systemsErer, Ahmet Mustafa; Oguz, Serkan20202020, vol.32, no.1
Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative studyAsghar, Rafiq; Rehman, Faisal; Aman, Ali; Iqbal, Kashif; Nawaz, Agha Ali20202020, vol.32, no.1
Filling efficiency of flip-chip underfill encapsulation processNg, Fei Chong; Abas, Mohamad Aizat; Abdullah, Mohd Zulkifly20202020, vol.32, no.1
Low RH and temperature effect on 0201 sized passive components during SMT mountingAsghar, Rafiq; Rehman, Faisal; Aman, Ali; Iqbal, Kashif20202020, vol.32, no.1
Pulse plated Sn-Cu solder coatings from stannate bathSharma, Ashutosh; Ahn, Byungmin20202020, vol.32, no.1
Stress analysis and structural optimization of 3-D IC package based on the Taguchi methodXiong, Ming-Yue; Zhang, Liang; He, Peng; Long, Wei-Min20202020, vol.32, no.1
Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnectsKharbanda, D. K.; Suri, N.; Khanna, P. K.20202020, vol.32, no.1



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