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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloysM. Reid; J. Punch; M. Collins; C. Ryan20082008, vol.20, no.4
Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVAK. Bukat; J. Sitek; R. Kisiel; Z. Moser; W. Gasior; M. Koscielski; J. Pstrus20082008, vol.20, no.4
Thermal profiling: a reflow process based on the heating factorJin Gang Gao; Yi Ping Wu; Han Ding; Nian Hong Wan20082008, vol.20, no.4
Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additivesToshihiro Miyake; Masaru Ishida; Satoshi Inagaki20082008, vol.20, no.4
Workmanship standards and their application on ESA projectsBarrie D. Dunn20082008, vol.20, no.4



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