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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
Effect of strain on whisker growth in matte tinA. R. Southworth; C. E. Ho; A. Lee; K. N. Subramanian20082008, vol.20, no.1
Effect of interconnection area on shear strength of sintered joint with nano-silver pasteKun Qi; Xu Chen; Guo-Quan Lu20082008, vol.20, no.1
Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigueAndreas R. Fix; Wolfgang Nuchter; Jurgen Wilde20082008, vol.20, no.1
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free soldersR. S. Lai; K. L. Lin; B. Salam20082008, vol.20, no.1



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