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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2007, vol.19, no.1 2007, vol.19, no.2 2007, vol.19, no.3 2007, vol.19, no.4

题名作者出版年年卷期
Assembly issues with Sn/Ag/Cu bumped flip chipsSunil Gopakumar; Peter Borgesen; K. Srihari20072007, vol.19, no.4
Hydrocarbon fluxes for ionic compound free solderingToshihiro Miyake; Masaru Ishida; Satoshi Inagaki20072007, vol.19, no.4
Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrateZ. W. Zhong; P. Arulvanan; Hla Phone Maw; C. W. A. Lu20072007, vol.19, no.4
Low cycle isothermal fatigue properties of lead-free soldersMilos Dusek; Christopher Hunt20072007, vol.19, no.4



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