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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2007, vol.19, no.1 2007, vol.19, no.2 2007, vol.19, no.3 2007, vol.19, no.4

题名作者出版年年卷期
Dissolution of copper on Sn-Ag-Cu system lead free solderGoro Izuta; Tsuyoshi Tanabe; Katsuaki Suganuma20072007, vol.19, no.2
Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loadingMichael Osterman; Michael Pecht20072007, vol.19, no.2
Global environmental impact assessment of the Pb-free shiftAnders S. G. Andrae; Norihiro Itsubo; Atsushi Inaba20072007, vol.19, no.2
High-cycle fatigue testing of Pb-free solder jointsN. Barry; I. P. Jones; T. Hirst; I. M. Fox; J. Robins20072007, vol.19, no.2



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