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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2008, vol.130, no.1
2008, vol.130, no.2
2008, vol.130, no.3
2008, vol.130, no.4
题名
作者
出版年
年卷期
Steady-State Behavior of a Three-Dimensional Pool-Boiling System
Michel Speetjens
2008
2008, vol.130, no.4
Microscale and Nanoscale Thermal Characterization Techniques
J. Christofferson; K. Maize; Y. Ezzahri; J. Shabani; X. Wang; A. Shakouri
2008
2008, vol.130, no.4
Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
Saketh Mahalingam; Ananth Prabhakumar; Sandeep Tonapi; Suresh K. Sitaraman
2008
2008, vol.130, no.4
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
S. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung
2008
2008, vol.130, no.4
Electromigration Reliability With Respect to Cu Weight Contents of Sn-Ag-Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
Yi-Shao Lai; Ying-Ta Chiu
2008
2008, vol.130, no.4
Design for Reliability Applied to Packaging of a MOEMS Switch
Abiodun A. Fasoro; Manoj Mittal; Dan O. Popa; Dereje A. Agonafer; Harry E. Stephanou
2008
2008, vol.130, no.4
An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
Victor Chiriac; Florea Chiriac
2008
2008, vol.130, no.4
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
Karl J. L. Geisler; Avram Bar-Cohen
2008
2008, vol.130, no.4
Flip-Chip Interconnect for Coplanar Strip Lines
Young K. Song; Chin C. Lee
2008
2008, vol.130, no.4
Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
Wataru Nakayama
2008
2008, vol.130, no.4
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