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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
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1995~2024
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2004, vol.126, no.1
2004, vol.126, no.2
2004, vol.126, no.3
2004, vol.126, no.4
题名
作者
出版年
年卷期
Highlights from the European Thermal Project PROFIT
Clemens J. M. Lasance
2004
2004, vol.126, no.4
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Tong Hong Wang; Yi-Shao Lai; Jenq-Dah Wu
2004
2004, vol.126, no.4
Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
Yasin Makwana; Dereje Agonafer; Dan Manole
2004
2004, vol.126, no.4
Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
C. P. Tso; K. W. Tou; H. Bhowmik
2004
2004, vol.126, no.4
Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
Y. C. Chan; M. O. Alam; K. C. Hung; H. Lu; C. Bailey
2004
2004, vol.126, no.4
Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment
Gamal Refai-Ahmed; Stephanie Trottier
2004
2004, vol.126, no.4
An Analytical Study of the Optimized Performance of an Impingement Heat Sink
S. B. Sathe; B. G. Sammakia
2004
2004, vol.126, no.4
Methodology for an Integrated (Electrical/Mechanical) Design of PWBA
Wonkee Ahn; Dereje Agonafer; Shlomo Novotny
2004
2004, vol.126, no.4
Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
Siddharth Bhopte; Musa S. Alshuqairi; Dereje Agonafer; Gamal Refai-Ahmed
2004
2004, vol.126, no.4
Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Roger Schmidt; Ethan Cruz
2004
2004, vol.126, no.4
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