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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2023, vol.35, no.2 2023, vol.35, no.3 2023, vol.35, no.4 2023, vol.35, no.5

题名作者出版年年卷期
Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assistedGan, Guisheng; Jiang, Liujie; Liu, Cong; Huang, Tian; Ma, Peng; Cheng, Dayong; Liu, Xin; Chen, Shiqi20232023, vol.35, no.3
A review: effect of copper percentage solder alloy after laser solderingAbdullah, Asyraf; Aisha Idris, Siti Rabiatull20232023, vol.35, no.3
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperatureGan, Guisheng; Chen, Shiqi; Jiang, Liujie; Huang, Tian; Cheng, Dayong; Liu, Xin; Xu, Qianzhu20232023, vol.35, no.3
IC solder joint inspection via adaptive statistical modelingXiao, Meng; Cai, Nian; Mo, Zhuokun; Yan, Shule; Tian, Nili; Jing; Wang, Han20232023, vol.35, no.3
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solderAl-sorory, Hamed; Gumaan, Mohammed S.; Shalaby, Rizk Mostafa20232023, vol.35, no.3
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow processNg, Fei Chong; Abas, Aizat; Ramli, Mohamad Riduwan; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che20232023, vol.35, no.3



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