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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2019, vol.31, no.1 2019, vol.31, no.2 2019, vol.31, no.3 2019, vol.31, no.4

题名作者出版年年卷期
Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloysGharaibeh, Mohammad; Stewart, Aaron J.; Su, Quang T.; Pitarresi, James M.20192019, vol.31, no.2
Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave conditionYusoff, Wan Yusmawati Wan; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria20192019, vol.31, no.2
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solderKolenak, Roman; Kostolny, Igor; Drapala, Jaromir; Kusy, Martin; Pasak, Matej20192019, vol.31, no.2
Characterization of SAC - x NiO nano-reinforced lead-free solder joint in an ultra-fine package assemblyAni, Fakhrozi Che; Jalar, Azman; Saad, Abdullah Aziz; Bachok, Zuraihana; Othman, Norinsan Kamil; Khor, Chu Yee; Abas, Mohamad Aizat20192019, vol.31, no.2
Design of a bi-manual haptic interface for skill acquisition in surface mount device solderingJames, Jose; Rao, Bhavani R.; Neamtu, Gabriel20192019, vol.31, no.2
Influence of thermal shock cycles on Sn-37Pb solder bumpsGan, Guisheng; Xia, Da-quan; Liu, Xin; Liu, Cong; Cheng, Hanlin; Ming, Zhongzhen; Gao, Haoyang; Yang, Dong-hua; Wu, Yi-ping20192019, vol.31, no.2
Rheology of F620 solder paste and fluxBarbosa, Flavia, V; Teixeira, Jose C. F.; Teixeira, Senhorinha F. C. F.; Lima, Rui A. M. M.; Soares, Delfim F.; Pinho, Diana M. D.20192019, vol.31, no.2



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