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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solderHasnine, Md20182018, vol.30, no.4
Reliability studies of InnoLot and SnBi joints soldered on DBC substrateSkwarek, Agata; Illes, Balazs; Witek, Krzysztof; Hurtony, Tamas; Tarasiuk, Jacek; Wronski, Sebastian; Synkiewicz, Beata Kinga20182018, vol.30, no.4
Bonding of Si chips to low carbon steel boards using electroplated Sn solderHsu, Shou-Jen; Lee, Chin C.20182018, vol.30, no.4
Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specificationsHuang, Chien-Yi20182018, vol.30, no.4
Solder joint inspection using eigensolder featuresWu, Hao; Xu, Xiangrong20182018, vol.30, no.4



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