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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2016, vol.28, no.1 2016, vol.28, no.2 2016, vol.28, no.3 2016, vol.28, no.4

题名作者出版年年卷期
A review: lead free solder and its wettability propertiesNoor, Ervina Efzan Mhd; Nasir, Nur Faziera Mhd; Idris, Siti Rabiatul Aisya20162016, vol.28, no.3
Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrateXu, Bingsheng; Wu, Yan; Zhang, Lina; Chen, Junwei; Yuan, Zhangfu20162016, vol.28, no.3
Intermetallic growth and shear strength of SAC305/EN-BoronKahar, Hardinnawirda; Idris, Siti Rabiatull Aisha; Ishak, Mahadzir; Abd Malek, Zetty Akhtar20162016, vol.28, no.3
Direct bonding of silicon with solders type Sn-Ag-TiKostolny, Igor; Sahul, Martin; Kolenak, Roman20162016, vol.28, no.3
Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y. C.; Liu, Changqing; Wu, Fengshun20162016, vol.28, no.3
High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation methodKong, Xiangxia; Sun, F.; Yang, Miaosen; Liu, Yang20162016, vol.28, no.3



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