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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2015, vol.27, no.1 2015, vol.27, no.2 2015, vol.27, no.3 2015, vol.27, no.4

题名作者出版年年卷期
Investigating and compensating printed circuit board shrinkage induced failures during reflow solderingGeczy, Attila; Fejos, Marta; Tersztyanszky, Laszlo20152015, vol.27, no.2
Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentrationAli, Bakhtiar20152015, vol.27, no.2
Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cyclingChen, Jibing; Yin, Yanfang; Ye, Jianping; Wu, Yiping20152015, vol.27, no.2
Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentationChew, C. S.; Durairaj, R.; Haseeb, A. S. M. A.; Beake, B.20152015, vol.27, no.2
Dissolution kinetics of copper in lead-free liquid soldersFaizan, Mohammad20152015, vol.27, no.2
Investigating and compensating printed circuit board shrinkage induced failures during reflow solderingGeczy, Attila; Fejos, Marta; Tersztyanszky, Laszlo20152015, vol.27, no.2
Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentrationAli, Bakhtiar20152015, vol.27, no.2
Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cyclingChen, Jibing; Yin, Yanfang; Ye, Jianping; Wu, Yiping20152015, vol.27, no.2
Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentationChew, C. S.; Durairaj, R.; Haseeb, A. S. M. A.; Beake, B.20152015, vol.27, no.2
Dissolution kinetics of copper in lead-free liquid soldersFaizan, Mohammad20152015, vol.27, no.2



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