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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2014, vol.26, no.1 2014, vol.26, no.2 2014, vol.26, no.3 2014, vol.26, no.4

题名作者出版年年卷期
Influence of PTH offset angle in wave soldering with thermal-coupling methodMohd Sharizal Abdul Aziz; Mohd Zulkifly Abdullah; Chu Yee Khor20142014, vol.26, no.3
A method for the tin pest presence testing in SnCu solder alloysAgata Skwarek; Jan Kulawik; Andrzej Czerwinski; Mariusz Pluska; Krzysztof Witek20142014, vol.26, no.3
Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applicationsJussi Putaala; Olli Salmela; Olli Nousiainen; Tero Kangasvieri; Jouko Vahakangas; Antti Uusimaki; Jyrki Lappalainen20142014, vol.26, no.3
Solder joint imagery compressing and recovery based on compressive sensingHuihuang Zhao; Yaonan Wang; Zhijun Qiao; Bin Fu20142014, vol.26, no.3
Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuitsBarrie D. Dunn; Grazyna Mozdzen20142014, vol.26, no.3
Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloysErvina Efzan Mhd Noor; Amares Singh20142014, vol.26, no.3
Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurementWeisheng Xia; Ming Xiao; Yihao Chen; Fengshun Wu; Zhe Liu; Hongzhi Fu20142014, vol.26, no.3



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