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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2010, vol.22, no.1 2010, vol.22, no.2 2010, vol.22, no.3 2010, vol.22, no.4

题名作者出版年年卷期
Activities during melting and reflowing behaviour of soldersJ. Mittal; K. L. Lin20102010, vol.22, no.1
Effect of stand-off height on the microstructure and mechanical behaviour of solder jointsBo Wang; Fengshun Wu; Yiping Wu; Hui Liu; Longzao Zhou; Yuebo Fang20102010, vol.22, no.1
Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic fluxPatrick Zerrer; Andreas Fix; Matthias Hutter; Herbert Reichl20102010, vol.22, no.1
X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)Mihaly Janoczki; Laszlo Jakab20102010, vol.22, no.1
Moisture effects on adhesion of non-conductive adhesive attachmentsKirsi Saarinen; Pekka Heino20102010, vol.22, no.1
An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assembliesGuangbin Dou; David C. Whalley; Changqing Liu; Y. C. Chan20102010, vol.22, no.1
Tin pest in lead-containing soldersW. J. Plumbridge20102010, vol.22, no.1



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