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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Properties of two new medium temperature soldersChunyuan Li; Xitao Wang; Wenxia Yuan20092009, vol.21, no.2
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticlesC. D. Zou; Y. L. Gao; B. Yang; Q. J. Zhai; C. Andersson; J. Liu20092009, vol.21, no.2
The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fieldsCong-qian Cheng; Jie Zhao; Yang Xu; Fu-Min Xu; Ming-liang Huang20092009, vol.21, no.2
Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and agingNing Zhao; Hai-tao Ma; Lai Wang20092009, vol.21, no.2
Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)M. Noren; S. Brunner; C. Hoffmann; W. Salz; K. Aichholzer20092009, vol.21, no.2
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packagesC. Andersson; B. Vandevelde; C. Noritake; P. Sun; P. E. Tegehall; D. R. Andersson; G. Wetter; J. Liu20092009, vol.21, no.2
A study of thermo-mechanical reliability of lead-free PTH solder jointsJennifer Nguyen; David Geiger; Dan Rooney; Dongkai Shangguan20092009, vol.21, no.2
Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder jointS. Chen; P. Sun; X. C. Wei; Z. N. Cheng; J. Liu20092009, vol.21, no.2



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