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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



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2023

2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
RLC effects in fine pitch anisotropic conductive film connectionsG. Don; Y. C. Chan; F. E. Morris; D. C. Whalley20062006, vol.18, no.1
Implementing lead-free solders - the performance aspectsW. F. Plumbridge20062006, vol.18, no.1
Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5AgH. Rhee; K. N. Subramanian20062006, vol.18, no.1
Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow toolsN. Geren; M. Cakirca; M. Bayramoglu20062006, vol.18, no.1
Modelling of microstructure and damage evolution in Sn-Pb solderY. Wei; C. L. Chow; H. E. Fang; W. Y. Lu; J. Lim20062006, vol.18, no.1



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