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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2024
2024, vol.146, no.2
题名
作者
出版年
年卷期
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials
Chen, Jiawei; Yan, Zhongming; Qiao, Yang; Lin, Feihong; Wang, Yu; Zhou, Hongcheng
2024
2024, vol.146, no.2
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
Lin, Yujui; Wei, Tiwei; Moy, Wyatt Jason; Chen, Hao; Gupta, Man Prakash; Degner, Michael; Asheghi, Mehdi; Goodson, Kenneth E.; Mantooth, H. Alan
2024
2024, vol.146, no.2
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
Wang, Tongju; Liu, Yahao; Zhang, Wenqian; Lei, Yongping; Lin, Jian; Fu, Hanguang; Lin, Zipeng
2024
2024, vol.146, no.2
Hybrid Substrates for Heterogeneous Integration
Lau, John H.; Chen, Gary Chang-Fu; Yang, Channing Cheng-Lin; Teng, Vincent; Peng, Andy Yan-Jia; Huang, Jones Yu-Cheng; Liu, Hsing-Ning; Chen, Y. H.; Tseng, Tzyy-Jang; Li, Ming
2024
2024, vol.146, no.2
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
Khalid, R.; Youssef, E.; Amalfi, R. L.; Wemhoff, A. P.; Ortega, A.
2024
2024, vol.146, no.2
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
Kumar, Amit; Majumder, Ayan; Cardenas, Ruander; Macdonald, Mark; Bhattacharya, Anandaroop
2024
2024, vol.146, no.2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
Cai, Chongyang; Wang, Huayan; Yang, Junbo; Yin, Pengcheng; Park, S. B.
2024
2024, vol.146, no.2
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Osman, Ammar; Moreno, Gilberto; Myers, Steve; Major, Joshua; Feng, Xuhui; Narumanchi, Sreekant V. J.; Joshi, Yogendra
2024
2024, vol.146, no.2
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
Ha, Jonghwan; Lai, Yangyang; Yang, Junbo; Yin, Pengcheng; Park, Seungbae
2024
2024, vol.146, no.2
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
2024
2024, vol.146, no.2
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