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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2021, vol.143, no.1
2021, vol.143, no.2
2021, vol.143, no.3
2021, vol.143, no.4
题名
作者
出版年
年卷期
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces
She, Zhenyu; Dhir, Vijay K.
2021
2021, vol.143, no.4
Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
Lin, Cheng-Hui; Won, Yoonjin
2021
2021, vol.143, no.4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Chuang, Jimmy; Yang, Jin; Shia, David; Li, Y. L.
2021
2021, vol.143, no.4
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
Jin, Qi; Wen, John T.; Narayanan, Shankar
2021
2021, vol.143, no.4
Viability of Cryogenic Cooling to Reduce Processor Power Consumption
Nordlund, Alec; Harrison, Matthew; Gess, Joshua
2021
2021, vol.143, no.4
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
Miglani, Ankur; Soto, Anali; Weibel, Justin A.; Garimella, Suresh, V
2021
2021, vol.143, no.4
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads
Anderson, Caleb; Richey, Joshua; Fish, Michael; Bandhauer, Todd
2021
2021, vol.143, no.4
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
Guye, Kidus; Dong, De; Kim, Yunseo; Lee, Hyoungsoon; Dogruoz, Baris; Agonafer, Damena
2021
2021, vol.143, no.4
Special Issue Dedicated to Professor Avram Bar-Cohen
Warzoha, Ronald J.; Sharar, Darin J.; Amalfi, Raffaele Luca; Tay, Andrew
2021
2021, vol.143, no.4
Reduced Order Design Optimization of Liquid Cooled Heat Sinks
Lad, Aniket Ajay; James, Kai A.; King, William P.; Miljkovic, Nenad
2021
2021, vol.143, no.4
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